IEEE - Institute of Electrical and Electronics Engineers, Inc. - Nanometer-scale copper electrodeposition from an on-chip source

Author(s): M.W. Wu ; L.L. Sohn
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2000
Volume: 21
Page Count: 3
Page(s): 277 - 279
ISSN (Paper): 0741-3106
ISSN (Online): 1558-0563
DOI: 10.1109/55.843149
Regular:

Using both an on-chip anode as a source of copper and a copper-free, acidic electroplating solution, we have fabricated electrodes with separations on the order of 10 nm or less. During the... View More

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