IEEE - Institute of Electrical and Electronics Engineers, Inc. - Multimetal DTAB packages for a 125-MHz computer

Author(s): Kaw, R. ; Yanaga, D. ; Matta, F.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1992
Conference Location: San Diego, CA, USA, USA
Conference Date: 18 May 1992
Page(s): 450 - 457
ISBN (Paper): 0-7803-0167-6
DOI: 10.1109/ECTC.1992.204245
Regular:

The authors discuss the challenges in packaging a 430-pin IC chip that operates at 2 V and draws 15 A, with risetimes of about 200 ps. A 407-pin multilayer ceramic package (pin grid array) was... View More

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