IEEE - Institute of Electrical and Electronics Engineers, Inc. - No-clean And Water-clean Mass Reflow Processes Of 0.4 mm Pitch, 256-Pin Fine Pitch Quad Flat Packs (QFP)

Author(s): Lau, J. ; Govila, R. ; Larner, C. ; Yi-Hsin Pao ; Erasmus, S. ; Dolot, S. ; Solberg, V.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1992
Conference Location: Baltimore, MD
Conference Date: 28 September 1992
Page(s): 305 - 315
ISBN (Paper): 0-7803-0755-0
DOI: 10.1109/IEMT.1992.639909
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