IEEE - Institute of Electrical and Electronics Engineers, Inc. - Bare die test

Author(s): Parker, R.H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1992
Conference Location: Santa Cruz, CA, USA, USA
Conference Date: 18 March 1992
Page(s): 24 - 27
ISBN (Paper): 0-8186-2725-5
DOI: 10.1109/MCMC.1992.201438
Regular:

The author describes a bare die test approach that uses a temporary interconnect technique overlaid on a reconstructed pseudo-wafer of individual bare dice. This overlay technique maps... View More

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