IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

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Organization: IEC - International Electrotechnical Commission
Publication Date: 21 July 2008
Status: published
Page Count: 20
ICS Code (Environmental testing): 19.040

Abstracts

abstract

IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following:
- the solder globule test is deleted;
- test conditions and requirements for lead-free solders are added.

Document History

IEC 60068-2-20:2008 - Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
July 21, 2008 - IEC - International Electrotechnical Commission

IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder allo...

IEC 60068-2-20:2008 - Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
July 21, 2008 - IEC - International Electrotechnical Commission

IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder allo...

IEC 60068-2-20:1979/AMD2:1987 - Amendment 2 - Basic environmental testing procedures - Part 2-20: Tests - Test T: Soldering
January 1, 1987 - IEC - International Electrotechnical Commission
A description is not available for this item.
IEC 60068-2-20:1979/AMD2:1987 - Amendment 2 - Basic environmental testing procedures - Part 2-20: Tests - Test T: Soldering
January 1, 1987 - IEC - International Electrotechnical Commission
A description is not available for this item.
IEC 60068-2-20:1979/AMD1:1986 - Amendment 1 - Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
July 1, 1986 - IEC - International Electrotechnical Commission
A description is not available for this item.
IEC 60068-2-20:1979/AMD1:1986 - Amendment 1 - Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
July 1, 1986 - IEC - International Electrotechnical Commission
A description is not available for this item.
IEC 60068-2-20:1979 - Environmental testing. Part 2: Tests. Test T: Soldering
January 1, 1979 - IEC - International Electrotechnical Commission

Describes solderability tests on wire and tag terminations (Ta) and printed wiring boards (Tc), also describes tests for resistance to soldering heat, applicable to components (Tb).

IEC 60068-2-20:1979 - Environmental testing. Part 2: Tests. Test T: Soldering
January 1, 1979 - IEC - International Electrotechnical Commission

Describes solderability tests on wire and tag terminations (Ta) and printed wiring boards (Tc), also describes tests for resistance to soldering heat, applicable to components (Tb).

IEC 60068-2-20:1968 - Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering
January 1, 1968 - IEC - International Electrotechnical Commission
A description is not available for this item.
IEC 60068-2-20:1968 - Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering
January 1, 1968 - IEC - International Electrotechnical Commission
A description is not available for this item.
IEC 60068-2-20:1960 - Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering
January 1, 1960 - IEC - International Electrotechnical Commission
A description is not available for this item.
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