Changes along the electronics value chain GÇö Packaging as a key enabler
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Michael Alexander
Year: 2015
Document Type: Conference Proceeding
Industry consortium for new era of automotive electronics with entire system-on-package vision at Georgia Tech
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Klaus-Juergen Wolter; Venky Sundaram; Vanessa Smet; Rao Tummala; Pulugurtha M. Raj
Year: 2015
Document Type: Conference Proceeding
Future 2050 - The most important technologies in the decades to come
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Ulrich Eberl
Year: 2015
Document Type: Conference Proceeding
Investigation of fracture mechanisms and bond-line of insert bump bonding specimens
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Seung Man Kim; Tae Ho Ha; Chang Woo Lee; Jae Hak Lee; Jun Yeob Song; Yong Jin Kim; Young Kang Lee
Year: 2015
Document Type: Conference Proceeding
Wire bonding of Au-coated Ag wire: Bondwire properties, bondability and IMCs formation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Fei-Yi Hung; Yi-Wei Tseng; Truan-Sheng Lui
Year: 2015
Document Type: Conference Proceeding
Bump scaling and shear test requirements
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Rene Zingg
Year: 2015
Document Type: Conference Proceeding
Isotropic conductive paste based on epoxy with Ag coated Cu and SAC305 solder
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Yong-Sung Eom; Kwang-Seong Choi; Hyun-Cheol Bae; Hak-Son Lee; Jin-Ho Lee
Year: 2015
Document Type: Conference Proceeding
Reliability prediction for textile packages
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Hartmann Hieber
Year: 2015
Document Type: Conference Proceeding
Influence of the PCB attachment on the mechanical properties in modal analysis
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Ivan Szendiuch; Boleslav Psota; Alexandr Otahal
Year: 2015
Document Type: Conference Proceeding
A crack propagation analysis of multilayer ceramic capacitors
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Joseph Al Ahmar; Steffen Wiese
Year: 2015
Document Type: Conference Proceeding
Conformal barrier/seed layers deposition for voids free copper electroplating in high aspect ratio TSV
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Wan Cheng; Heng Wu; Chongshen Song; Wenqi Zhang; Susu Yang
Year: 2015
Document Type: Conference Proceeding
Functional surface coating of screens and stencils for thick film application
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Ralf Weber
Year: 2015
Document Type: Conference Proceeding
Design, setup and test of a heterogeneous module and characterization by stress measurement
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Claus Reitlinger; Franz Kaul; Thomas Metzger; Thomas Schreier-Alt; Kees Revenberg
Year: 2015
Document Type: Conference Proceeding
WiCkeD tool-based design method for divide-by-2 circuits with multiple loads
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Raphael Ronald Noal Souza; Leandro Tiago Manera; Agord de Matos Pinto; Yuzo Iano
Year: 2015
Document Type: Conference Proceeding
System I/O optimization with SoC, SiP, PCB co-design
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Nikola Kontic; Kazunari Koga; Ralf Bruning; Humair Mandavia
Year: 2015
Document Type: Conference Proceeding
Thermal considerations for systems with high speed memories
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Andy Heinig; Dimitrios Papaioannou; Robert Fischbach
Year: 2015
Document Type: Conference Proceeding
Cost-effective thermoelectric cooler packaging using hybrid Cu paste
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Seung Eon Moon; Kwang-Seong Choi; Aesun Oh; Hyun-Cheol Bae; Haksun Lee; Jin Ho Lee; Yong-Sung Eom
Year: 2015
Document Type: Conference Proceeding
Temperature stabilized chip expander
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jaroslav Jankovsky; Michal Reznicek; Martin Bursik; Richard Ruzicka; Vaclav Simek
Year: 2015
Document Type: Conference Proceeding
Investigation on the suitability of electrically conductive adhesives for die-attachment of power devices
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Andreas Lindemann; Eike Moller; Folkhart Grieger; Jurgen Wilde; Lars Middelstadt
Year: 2015
Document Type: Conference Proceeding
Impact strength of Sn-58mass%Bi/Cu joints by laser process
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Hiroshi Nishikawa; Sinya Kubota
Year: 2015
Document Type: Conference Proceeding
Lapping and polishing of different LTCC substrates for thin film applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Michael Fischer; Nam Gutzeit; Jens Muller; Heike Bartsch
Year: 2015
Document Type: Conference Proceeding
Fabrication of elastic bumps and narrow metal patterning for Si-based flexible electronics
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Yongjin Kim; Joon Yub Song; Ju Yong Lee; Jae Hak Lee; Chang Woo Lee; Tae Ho Ha; Seung Man Kim
Year: 2015
Document Type: Conference Proceeding
Improved CFD analysis of wave soldering in pin through-hole technology
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Steffen Wiese; Heinz Wohlrabe; Adam Yuile
Year: 2015
Document Type: Conference Proceeding
Electrical tensile test
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Hao-Wen Hsueh; Fei-Yi Hung; Li-Hui Chen; Truan-Sheng Lui
Year: 2015
Document Type: Conference Proceeding
Development of a new piezoelectric sensor to measure loads
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Sophie Engelsberger; Tobias Schmidt; Anton Harasim
Year: 2015
Document Type: Conference Proceeding
Large area, transparent heaters based on carbon nanotubes and graphene platelets for heated glass application
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Daniel Janczak; Grzegorz Wroblewski; Lucja Sarapuk-Dybowska; Malgorzata Jakubowska; Marcin Sloma
Year: 2015
Document Type: Conference Proceeding
Plasma dicing for thin wafers
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Reinhard Windemuth
Year: 2015
Document Type: Conference Proceeding
Ultra-thin high density capacitors for advanced packaging solutions
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Malte Czernohorsky; Mathias Bottcher; Konrad Seidel; Stefan Riedel; Stefan Dobritz; Wenke Weinreich
Year: 2015
Document Type: Conference Proceeding
Development of a statistical approach for DNA-based nanowires electrical study
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Severine Cheramy; Raluca Tiron; Simona Torrengo; Pierre-Henri Elchinger; Patrick Reynaud; Cheikh Tidiane-Diagne; Corentin Carmignani; Christophe Brun; Didier Gasparutto; Aurelie Thuaire; Arianna Filoramo; Xavier Baillin
Year: 2015
Document Type: Conference Proceeding
Advanced interposers with metalized through via
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Yoshitaka Fukuoka; Sumio Koiwa; Takamasa Takano; Satoru Kuramochi; Kousuke Suzuki; Miyuki Akazawa; Hiroshi Mawatari
Year: 2015
Document Type: Conference Proceeding
Thermally enhanced FOWLP-development of a power-eWLB demonstrator
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Andre Cardoso; Gusztav Hantos; Mariana Pires; Steffen Kroehnert; Raquel Pinto
Year: 2015
Document Type: Conference Proceeding
Cutting the cost of packaging with nanoceramic substrates
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Giles Humpston
Year: 2015
Document Type: Conference Proceeding
Quantifying the thermal conductivity enhancement of percolating thermal underfills
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:G. Schlottig; J. Zurcher; Brian R. Burg; T. Brunschwiler; X. Chen
Year: 2015
Document Type: Conference Proceeding
"Non-piercing" GÇö A must for flip chips!
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Ingolf Schlosser
Year: 2015
Document Type: Conference Proceeding
Ni-Sn solid-liquid interdiffusion (SLID) bonding for thermo-electric elements in extreme environments — FEA of the joint stress
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Andreas Larsson; Torleif A. Tollefsen; Ole Martin Lovvik; Knut E. Aasmundtveit
Year: 2015
Document Type: Conference Proceeding
Analysis of soldering processes using in-situ X-Ray observations
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Thomas Zerna; Martin Oppermann; Alexander Klemm
Year: 2015
Document Type: Conference Proceeding
Assembly and packaging of micro systems by using reactive bonding processes
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Frank Roscher; Georg Dietrich; Erik Pflug; Dirk Kahler; Axel Schumacher; Klaus Vogel; Stephan Knappmann; Stefan Braun; Silvia Hertel; Ulrike Gais; Wolfgang Reinert
Year: 2015
Document Type: Conference Proceeding
Challenges of wafer-level MEMS packaging
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Uwe Hansen; Ralf Reichenbach; Sebastian Schuler-Watkins
Year: 2015
Document Type: Conference Proceeding
Flexible packaging by film assisted molding for microintegration of MEMS based sensors
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Thomas Gunther; Karl-Peter Fritz; Armin Berndt; Andre Zimmermann; Daniel Hera; Christine Harendt; Christian Reuter; Heinz Kuck; Jan Dirk Schulze Spuntrup
Year: 2015
Document Type: Conference Proceeding
Flip-chip MEMS microphone package with small front-volume and large back-volume
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Sebastian Walser; Matthias Winter; Michael Loibl; Gregor Feiertag; Christian Siegel; Anton Leidl; Wolfgang Pahl
Year: 2015
Document Type: Conference Proceeding
Influence of sensor-package hermeticity-level on long-term drift for a piezoresistive MEMS pressure-sensor
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Asmund Sandvand; Einar Halvorsen; Henrik Jakobsen; Knut E. Aasmundtveit
Year: 2015
Document Type: Conference Proceeding
Nickel-free final finishes in the electronics industry
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Norbert Sitte; Andreas Gross
Year: 2015
Document Type: Conference Proceeding
Thin Film based lcp multi-layer circuits: Manufacturing technology and characterization
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Alexander Kaiser; Bruno Holl; Christian Herbort; Carlos Maximilian Bee; Gunther Baubock; Frederic Dupuis; Karl-Heinz Fritz; Karin Rues; Paul Matej; Sebastian Loffler; Rene von Metzen
Year: 2015
Document Type: Conference Proceeding
Combining organic and printed electronics in Hybrid System in Foil (HySiF) based smart skin for robotic applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jan Kostelnik; Jurgen Keck; Joachim N. Burghartz; Hagen Klauk; Alina Schreivogel; Mahadi-Ul Hassan; Tarek Zaki; Stefan Sailer; Yigit Mahsereci
Year: 2015
Document Type: Conference Proceeding
Innovative solutions for systems based on embedding of thin components into flexible printed circuit boards
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Thomas Gneiting; Muhammad Samir Alshahed; Andreas Kugler; Enno Lorenz; Christine Harendt; Jan Kostelnik; Joachim N. Burghartz; Jurgen Wolf
Year: 2015
Document Type: Conference Proceeding
Direct attach led soldering by new printable AuSn paste
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Manon Arch; Abdenacer Ait Mani
Year: 2015
Document Type: Conference Proceeding
A LED micro-display with 90+ù90 pixels on a 80 ++m pitch
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jun Su Lee; Brian Corbett; Marc Rensing; Patrick Degenaar; Pleun P. Maaskant; Peter O'Brien; Noreen Nudds; Mahbub Akhter
Year: 2015
Document Type: Conference Proceeding
Highly reliable thick film solutions for power LEDs and electronics
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Paul Gundel; Mark Challingsworth; Melanie Bawohl; Virginia Garcia; Ryan Persons; Christoph Czwickla; Christina Modes; Ilias Nikolaidis; Jessica Reitz
Year: 2015
Document Type: Conference Proceeding
Thermal simulations and design propositions for LEDs used in automotive applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:J. B. Millet; G. Thin; Y. Alayli; Z. Zojceski
Year: 2015
Document Type: Conference Proceeding
Solder paste residue corrosivity assessment: Bono test
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Celine Puechagut; Emmanuelle Guene; Anne-Marie Laugt; Richard Anisko
Year: 2015
Document Type: Conference Proceeding
The effect of thermal stress on the reliability of low Ag solder joints in high-power LEDs
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Timo Schreck; Stefan Harter; Michael Kaloudis; Miriam Rauer
Year: 2015
Document Type: Conference Proceeding
Comparative tests for lead-free solder bumps
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Ricardo Geelhaar; Rene Zingg; Armin Struwe; Evstatin Krastev; Chan Myat
Year: 2015
Document Type: Conference Proceeding
Effects of component stand-off height on reliability of solder joints in assembled electronic component
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:B. Ogunsemi; Emeka H. Amalu; Jude E. Njoku; Sabuj Mallik; Raj Bhatti
Year: 2015
Document Type: Conference Proceeding
Assembly of transducer array using anisotropic conductive film for medical imaging applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Knut E. Aasmundtveit; Trym Eggen; Hoang-Vu Nguyen
Year: 2015
Document Type: Conference Proceeding
Improvement of connectivity in Cu/OSP flip chip package using slow cure NCP
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Shinichi Munemura; Toshikazu Hocchi; Masaaki Hoshiyama; Makoto Kobayashi; Hiromi Sone; Hiroki Myodo; Hirotatsu Ikarashi; Yuusuke Kamata
Year: 2015
Document Type: Conference Proceeding
New MEMS die attach adhesives combining maximum flexibility and outstanding dispensability including screen printing
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Tobias Koniger
Year: 2015
Document Type: Conference Proceeding
Development of bimodal electrically conductive pastes with Ag micro- and nano-fillers for printing stretchable E-textile systems
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Masahiro Inoue; Yasunori Tada; Yosuke Itabashi
Year: 2015
Document Type: Conference Proceeding
Electrical, thermal and mechanical characterization of low temperature, pressure-less sintered silver bond interfaces
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Tilo Welker; Steffen Wiese; Jens Muller; Frank Kramer
Year: 2015
Document Type: Conference Proceeding
A novel approach for thin-film Ag-sintering process through Aerosol Jet Printing in power electronics
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Johannes Hoerber; Joerg Franke; Christopher Gruber; Aarief Syed-Khaja
Year: 2015
Document Type: Conference Proceeding
Failure analysis of Ag sintered joints after power cycling under harsh temperature conditions from + 30-¦C up to + 180-¦C
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Christian Ehrhardt; Constanze Weber; Matthias Hutter; Klaus-Dieter Lang
Year: 2015
Document Type: Conference Proceeding
Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:S. Rzepka; S. Stegmeier; R. Doring; R. Dudek; R. Eisele; M. Rittner; M. Hutter; F. Osterwald; K. Weidner; J. Rudzki; C. Ehrhardt
Year: 2015
Document Type: Conference Proceeding
The role of molding compound microstructure for packaging reliability
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Hartmut Fischer; Hasan Sadat Nabi; Alexander W. J. Gielen; Laurens Weiss
Year: 2015
Document Type: Conference Proceeding
CCGA solder column GÇö Reliable solution for absorbing large CTE mismatch
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Martin Hart
Year: 2015
Document Type: Conference Proceeding
Influence of humidity on reliability of plastic packages
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:M. van Dijk; O. Holck; T. Braun; R. Aschenbrenner; H. Walter; K.-F Becker; K.-D Lang; J. Bauer
Year: 2015
Document Type: Conference Proceeding
Design for reliability of Au-Sn and Cu-Sn based SLID bonds
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Antti Rautiainen; Vesa Vuorinen; Mervi Paulasto-Krockel
Year: 2015
Document Type: Conference Proceeding
Sol gel thin films on LTCC ceramic multilayers enable their use as thin film substrates
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Ulrike Brokmann; Robert Weiss; Boris Goj; Edda Radlein; Heike Bartsch; Jens Muller
Year: 2015
Document Type: Conference Proceeding
Thermal improvement of plastic laminate based LED modules with embedded chips
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Elmar Baur; Dirk Schweitzer; Axel Kaltenbacher; Andreas Waldschick; Andreas Munding; Thomas Hammer; Michael Herfurth; Martin Gruber; Klaus Pressel; Tino Both
Year: 2015
Document Type: Conference Proceeding
Embedded power electronics on the way to be launched
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Mike Morianz; Hannes Stahr
Year: 2015
Document Type: Conference Proceeding
Development of advanced power modules for electric vehicle applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Andreas Ostmann; Dionysios Manessis; Simon Whalley; Lars Boettcher; Klaus-Dieter Lang
Year: 2015
Document Type: Conference Proceeding
Silicon photonics assembly industrialisation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Massimo Fere; Mark Shaw; Luca Maggi; Adamo Bazzotti
Year: 2015
Document Type: Conference Proceeding
Multichannel optical link based on polymer multimode waveguides for board-level interchip communication
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Klaus-Jurgen Wolter; Karlheinz Bock; Krzysztof Nieweglowski; Lukas Lorenz
Year: 2015
Document Type: Conference Proceeding
Wafer-level integration technology for multi emitter high power fiber coupled lasers
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Karlheinz Bock; Lukas Lorenz; Klaus-Jurgen Wolter; Krzysztof Nieweglowski; Ralf Rieske
Year: 2015
Document Type: Conference Proceeding
Development of a microcamera with embedded image processor using panel level packaging
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Klaus-Dieter Lang; Christian Boehme; Andreas Ostmann; Kai Schrank
Year: 2015
Document Type: Conference Proceeding
Evaluation of the dielectric cure monitoring of epoxy molding compound in transfer molding process for electronic packages
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Karl-Friedrich Becker; Jan-Martin Kaiser; Burcu Kaya; Klaus-Dieter Lang; Tanja Braun
Year: 2015
Document Type: Conference Proceeding
Functionalized sensor packaging based on thermoset injection molding and selective metallization technology
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Stefan Beichter; Simon Petillon; Thomas Gunther; Sascha Weser; Benno Haug; Andre Zimmermann; Hagen Muller; Wolfgang Eberhardt
Year: 2015
Document Type: Conference Proceeding
Biased humidity degradation model for Cu-Al wire bonded contacts based on molding compound properties
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Amar Mavinkurve; Rene Rongen; Leon Goumans; Mark Luke Farrugia; Michiel van Soestbergen; Orla O'Halloran
Year: 2015
Document Type: Conference Proceeding
Prospects of wire bonding as an approach for contacting additive manufactured Aerosol Jet printed structures
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Christopher Kaestle; Florian Oechsner; Joerg Franke; Johannes Hoerber
Year: 2015
Document Type: Conference Proceeding
FEM analysis of ball- and wedge bond techniques for the interconnection formation of soft die bonds
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:S. Wiese; F. Kraemer
Year: 2015
Document Type: Conference Proceeding
Si interposer with 10+ù100++m copper TSVs for 2.5D integration
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:S. Yang; U. Lee; W. Zhang; K. Xue; H. Li; C. Song; X. Jing; Z. Yong
Year: 2015
Document Type: Conference Proceeding
Low-temperature refill process for through-silicon-vias (TSVs) in stacked ultra-thin chip-on-wafer by Aerosol Jet printed silver
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Christine Harendt; J. N. Burghartz; Jurgen Keck; Saleh Ferwana; Mahadi-Ul Hassan
Year: 2015
Document Type: Conference Proceeding
Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Xiaomin Duan; Christian Schuster; David Dahl; Ivan Ndip; Stephan Dobritz; Klaus-Dieter Lang; Mathias Bottcher
Year: 2015
Document Type: Conference Proceeding
eWLB package for millimeter wave application
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Helmut Mayr; Gerhard Haubner; Jean Schmitt; Jagjit Singh Bal; Ismail Nasr; Johann Wurtele; Ngoc-Hoa Huynh; Maciej Wojnowski; Trotta Saverio; Uwe Rueddenklau; Sebastian Pahlke
Year: 2015
Document Type: Conference Proceeding
Application of the IForce piezoresistive silicon based stress sensor for prognostic and health monitoring methods
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Przemyslaw Gromala; Tobias Melz; Alicja Palczynska; Bongtae Han; Bulong Wu; Dirk Mayer; Dae-Suk Kim
Year: 2015
Document Type: Conference Proceeding
Void formation in Cu-Sn Solid-Liquid Interdiffusion (SLID) bonding
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Kaiying Wang; Thi-Thuy Luu; Knut E. Aasmundtveit; Nils Hoivik
Year: 2015
Document Type: Conference Proceeding
Adequate mechanical characterization of PCB copper traces for 2nd level FEM simulations
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:S. Wiese; F. Kraemer; D. Bruch
Year: 2015
Document Type: Conference Proceeding
Evaluation of pattern scale stress effects of 28nm technology during wire bond and Cu pillar flip chip assembly
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Sven Rzepka; Jurgen Auersperg; Dirk Breuer; Eberhard Kaulfersch; Birgit Bramer
Year: 2015
Document Type: Conference Proceeding
Manufacturing of flexible (ultra-)thin magnetic field sensors
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Oliver G. Schmidt; Thomas Zerna; J. Ingolf Monch; Daniel Ernst
Year: 2015
Document Type: Conference Proceeding
Integrated high-frequency sensors in catheters for minimally invasive plaque characterization
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Farabi Ibne Jamal; David Wagner; Christian Wenger; Chafik Meliani; Bertram Schmidt; Jan Wessel; Subhajit Guha; Ulrich Schumann; Markus Detert
Year: 2015
Document Type: Conference Proceeding
Temperature sensors based on thermoelectric effect
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Angelika Paproth; Axel Wodtke; Franz Bechtold; Paul Gierth; Lutz Lippmann; Klaus Irrgang; Klaus Augsburg; Lars Niedermeyer; Lars Rebenklau
Year: 2015
Document Type: Conference Proceeding
Very compact, water-cooled SiPM module for PET/MRT applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jorg Gosler; Ilaria Sacco; Elke Beyer; Peter Fischer; Rainer Dohle; Thomas Rittweg; Vladimir Chernyshev
Year: 2015
Document Type: Conference Proceeding
Heat sensitive joining method for miniaturized sensor components in medical technology
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Markus Detert; David Wagner; David Ranisch; Bertram Schmidt
Year: 2015
Document Type: Conference Proceeding
Lamination of 3D structures in LTCC using elastomer bags
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Artem Ivanov; Andrej Besborodow; Gerhard Sattelberger
Year: 2015
Document Type: Conference Proceeding
Solder wettability and solder joint reliability of rapid thermal firing thick film pastes
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Paul Gierth; Lars Rebenklau
Year: 2015
Document Type: Conference Proceeding
LTCC technology for microfluidic applications based on the gap waveguide technology
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Francois Gallee; Alejandro Valero-Nogueira; Christian Person; Cristina Arenas-Buendia
Year: 2015
Document Type: Conference Proceeding
Thickfilm ceramic ready for MCM interposer
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Marcus Herrmann; Sebastian Loffler; Karl-Heinz Fritz; Gunter Reppe; Angela Rebs; Alexander Kaiser; Christopher Mauermann
Year: 2015
Document Type: Conference Proceeding
Advancing packaging solutions using 3D capabilities of ceramic multilayers
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Karl-Heinz Suphan; Thomas Bartnitzek; Torsten Thelemann; Stefan Apel
Year: 2015
Document Type: Conference Proceeding
Conference program
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Year: 2015
Document Type: Conference Proceeding
Copyright page
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Year: 2013
Document Type: Conference Proceeding
Front matter
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Year: 2013
Document Type: Conference Proceeding
Challenges with manufacturability of package on package (PoP)
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Greg Caswell; Craig Hillman; Cheryl Tulkoff; Petri Savolainen
Year: 2013
Document Type: Conference Proceeding
New approach for assessment of dielectric layer adhesion strength, demonstrated on eWLB FO-WLP interfaces
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Raquel Pinto; Paulo Cardoso; Mario Ribeiro; Jorge Teixeira; Abel Janeiro
Year: 2013
Document Type: Conference Proceeding
Probabilistic design for reliability (PDfR) in space electronics and photonics: A change of vision
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:A. Bensoussan
Year: 2013
Document Type: Conference Proceeding
Board level reliability testing of hermetic packages equipped with high-rel interconnection solutions and dedicated to space applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Olivier Gaillard
Year: 2013
Document Type: Conference Proceeding
Verification of an LTCC packaging technology on board of the ongoing TET-1 satellite mission
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Matthias Rittweger; Tobias Klein; Reinhard Kulke; Gregor Mollenbeck; Carsten Gunner
Year: 2013
Document Type: Conference Proceeding
Coupling experimental and modelling results for device failure anticipation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Diane Ecoiffier; Pierre Vernhes
Year: 2013
Document Type: Conference Proceeding
Wafer-level AuSn and CuSn bonding for MEMS encapsulation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:P. Monnoyer; M. Paulasto-Krockel; S. Vahanen; V. Vuorinen; T. Suni; A. Jaakkola; H. Xu; H. Heikkinen
Year: 2013
Document Type: Conference Proceeding
Chemically resistant encapsulant to enable a novel MEMS fabrication process
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jacques Destine; Ester Tooten; Thomas Walewyns; Serguei Stoukatch; Laurent A. Francis; Fabrice Axisa
Year: 2013
Document Type: Conference Proceeding
Highly flexible die attach adhesives for MEMS packages
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Tobias Koniger
Year: 2013
Document Type: Conference Proceeding
Improved chip & component encapsulation by dedicated diffusion barriers to reduce corrosion sensitivity in biological and humid environments
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Ahmed Jarboui; Chris Van Hoof; Griet Uytterhoeven; Heidi Declercq; Jan Vanfleteren; Maria Cornelissen; Maarten Cauwe; Maaike Op de Beeck
Year: 2013
Document Type: Conference Proceeding
Analysis of stress in silicon-based microsystems by X-ray diffraction techniques
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:T. Bandi; A. Dommann; A. Neels
Year: 2013
Document Type: Conference Proceeding
Solid-Liquid Interdiffusion (SLID) bonding — Intermetallic bonding for high temperature applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Ani Duan; Knut E. Aasmundtveit; Nils Hoivik; Thi-Thuy Luu; Torleif A. Tollefsen; Kaiying Wang
Year: 2013
Document Type: Conference Proceeding
Ultra-fine pitch redistribution for 3D interposer
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:N. Allouti; P. Chausse; P. Nardi; L. Lachal; L. Gabette; M. L. Cordini; T. Magis; T. Mourier; S. Minoret; S. Delachanal; S. Cheramy; R. Segaud; R. Hida; R. Eleouet; H. Feldis; A. Charpentier; A. Roman; C. Aumont; C. Laviron; C. Ratin
Year: 2013
Document Type: Conference Proceeding
Power modules with embedded components
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:A. Ostmann; D. Manessis; K-D Lang; S. Karaszkiewicz; L. Boettcher
Year: 2013
Document Type: Conference Proceeding
Custom plastic ball grid array packages for microwave space applications up to 30 GHz
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Olivier Vendier; Nicolas Malgouyres; Sophie Dareys; Jean-Francois Villemazet; Barbara Bonnet
Year: 2013
Document Type: Conference Proceeding
Hermetic packaging for millimetre wave applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:J. Ollila; K. Kautio; T. Vaha-Heikkila; M. Kaunisto; M. Lahti
Year: 2013
Document Type: Conference Proceeding
Thin film flexible circuits: Technology, characteristics and applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:P. Matej; K. Ruess; G. Baubock; B. Holl; C. Herbort; A. Kaiser
Year: 2013
Document Type: Conference Proceeding
Assembly of high-aspect ratio optoelectronic sensor arrays on flexible substrates
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:A. Mann; A. Brauer; A. Bruckner; F. Kraze; W. Buss; R. Leitel
Year: 2013
Document Type: Conference Proceeding
Micro-structural changes and crack propagation in solder joints due to vibration
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jurgen Wilde; Andreas Fix; Bastian Reichling; Roumen Ratchev
Year: 2013
Document Type: Conference Proceeding
Study of influential parameters for lead-free flip chip solder joint cracking
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:R. Fontaine; V. Oberson; D. Danovitch; D. Drouin; A. Ayari-Kanoun; C. Fortin; I. Paquin
Year: 2013
Document Type: Conference Proceeding
Combining humidity testing and static bending with flip chip test structures
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Kati H. Kokko
Year: 2013
Document Type: Conference Proceeding
Novel investigation of influencing factors for corrosive interface degradation in wire bond contacts
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Sandy Klengel; Matthias Petzold; Robert Klengel; Tino Stephan
Year: 2013
Document Type: Conference Proceeding
Flex to flex bonding using anisotropic conductive film for imaging systems
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:T. Eggen; A. Lifjeld; C. E. Baumgartner; K. E. Aasmundtveit; K. Imenes; H-V Nguyen
Year: 2013
Document Type: Conference Proceeding
Impact of integrating microchannel cooling within 3D microelectronic packages for portable applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jean-Philippe Colonna; Francois de Crecy; Abdelkader Souifi; Vincent Fiori; Severine Cheramy; Sandrine Lhostis; Luc G. Frechette; Louis-Michel Collin
Year: 2013
Document Type: Conference Proceeding
BGA package technology considerations for high speed and RF applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Laurent Marechal; David Auchere; Yvon Imbs
Year: 2013
Document Type: Conference Proceeding
Embedded capacitor design rules in multilayer organic-based substrate for HF circuits
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Massar Wade; Tristan Dubois; Isabelle Bord-Majek; Genevieve Duchamp
Year: 2013
Document Type: Conference Proceeding
Release holes: Physical implementation checks for thin films packaging
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:J.-L Pornin; G. Cibrario; C. Jaffard; M. Gary
Year: 2013
Document Type: Conference Proceeding
Ball Grid Array package for automotive application: Strong link between design and 3D modeling
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Giovanni Graziosi; Arianna Morelli; Cristina Somma; Claudio Maria Villa; Sebastien Gallois-Garreignot; Patrice Joubert Doriol; Laurent Marechal
Year: 2013
Document Type: Conference Proceeding
Transfer molding of primary LED optics; High aspect ratio domes
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:R. H. Poelma; S. H. M. Kersjes; H. W. Wensink; J. L. J. Zijl
Year: 2013
Document Type: Conference Proceeding
Electro-optical strength assessment of white LEDs multichip modules for automotive forward-lighting application: Failure analysis and packaging influence
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:A. Gasse; B. Chambion; L. Bechou; L. Mendizabal; V. Carreau; Y. Deshayes
Year: 2013
Document Type: Conference Proceeding
Silicon embedded line integration for high end passive silicon interposer
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Thomas Magis; Thierry Mourier; Stephane Minoret; Robert Cuchet; Myriam Assous; Alain Toffoli; Fabienne Allain; Gilles Simon; Jean-Philippe Bally; Jean Charbonnier
Year: 2013
Document Type: Conference Proceeding
Heterogeneous packaging for mixed LED and electronic packages
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:B. R. de Jong; E. A. Patent; M. A. de Samber
Year: 2013
Document Type: Conference Proceeding
Packaging material issues in high temperature power electronics
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:M. Petzold; R. Klengel; S. Klengel; F. Naumann; B. Boettge
Year: 2013
Document Type: Conference Proceeding
Utilising advanced packaging technologies to enable smaller, more efficient GaN power devices
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Greg Klowak; Andy Longford
Year: 2013
Document Type: Conference Proceeding
Computational modeling of electrodepostion in small features under megasonic agitation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:M. K. Patel; N. Strusevich; C. Bailey
Year: 2013
Document Type: Conference Proceeding
Solder joint fatigue model for large silicon interposers
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:C. Ferrandon; D. Yap; F. de Crecy; G. Simon; S. Moreau
Year: 2013
Document Type: Conference Proceeding
Constitutive modeling of thin films under thermal cycling
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Balamurugan Karunamurthy; Tiphaine Pelisset; Thomas Antretter; Walther Heinz
Year: 2013
Document Type: Conference Proceeding
RF characterization and modeling of through-silicon vias
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:X. Sun; E. Beyne; G. Van der Plas; J. Ryckaert
Year: 2013
Document Type: Conference Proceeding
BGA packages classification to reach ESD CDM standards
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Gerald Afflard; Eric Picolet; David Auchere; David Aleo; Cedric Le Borgne; Celine Roussel; Alexandre Dray; Blaise Jacquier; Laurent Marechal; Stephan Jeune; Yvon Imbs; Corinne Richier
Year: 2013
Document Type: Conference Proceeding
Improvement of low-temperature sintered ink containing nano-Ag for ink-jet printing of conductive structures on flexible substrates
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Zbigniew Zaluk; Tomasz Falat; Michal Zawierta; Anita Smolarek; Andrzej Moscicki; Jan Felba
Year: 2013
Document Type: Conference Proceeding
Multi beam low-k grooving evaluation of various removal principals
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jeroen van Borkulo; Peter Dijkstra; Richard van der Stam
Year: 2013
Document Type: Conference Proceeding
Silicon interposers with integrated passive devices, an excellent alternativ to discrete components
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Frederic Voiron; Florent Lallemand
Year: 2013
Document Type: Conference Proceeding
Improvement of connectivity in Cu/OSP flip chip package using NCP
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Toyokazu Hocchi; Takuya Hoshino; Shinichi Munemura; Kiyoshi Kotaka; Masaaki Hoshiyama; Hiroki Myodo; Hirotatsu Ikarashi; Yosuke Sakai
Year: 2013
Document Type: Conference Proceeding
New method for deposition of thixotropic materials with resolution under 100 μm
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:M. Reznicek; M. Bursik; I. Szendiuch; J. Haze; J. Jankovsky
Year: 2013
Document Type: Conference Proceeding
Thermo-mechanical material characterization of organic polymer films in advanced packages using nanoindentation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Harald Preu; Georg Lorenz; Jurgen Walter; Matthias Petzold; Katrin Unterhofer; Walter Mack
Year: 2013
Document Type: Conference Proceeding
Smart neuroprobes with disposable micro-machined shank protection defined at wafer level
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:C. Mora Lopez; A. Andrei; P. Soussan
Year: 2013
Document Type: Conference Proceeding
Development of a conductometric biocompatible sensor for detecting ischemia
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Runar Strand-Amundsen; Tor Inge Tonnessen; Lars Holhjem; Knut E. Aasmundtveit
Year: 2013
Document Type: Conference Proceeding
Thermoplastic packaging and embedding technology for ID-cards
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Barbara Pahl; Christine Kallmayer; Joao Marques
Year: 2013
Document Type: Conference Proceeding
Dispersion of functionalized SiO2 particles into a Liquid Crystal Polymer matrix for a reliable HF package
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jean-Luc Diot; Isabelle Bord-Majek; Bruno Levrier; Komkrisd Wongtimnoi; Melanie Louarn; Thomas Frank; Walide Chenniki; Vincent Gaud; Virginie Verriere; Yves Ousten
Year: 2013
Document Type: Conference Proceeding
Thermal cycling of anisotropically conductive adhesive interconnections in demanding sensor applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Sanna Lahokallio; Laura Frisk; Anniina Parviainen
Year: 2013
Document Type: Conference Proceeding
PZT acoustic wave force sensor made in LTCC technology
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:L. J. Golonka; A. Dabrowski
Year: 2013
Document Type: Conference Proceeding
Importance of vibration testing for new technological configurations in electronics
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:M. Klapka; I. Szendiuch; B. Psota; A. Otahal
Year: 2013
Document Type: Conference Proceeding
Optimized wire-bond transitions for microwave applications up to 67 GHz using the low loss LTCC material DuPont 9k7
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Alexander Schulz; Dirk Stopel; Jens Muller; Frank Wollenschlager; Tilo Welker; Robert Muller
Year: 2013
Document Type: Conference Proceeding
Heterogeneous wafer reconstruction and wafer level hybridization by copper direct bonding for Infrared imagers
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Abdenacer Ait Mani; Stephanie Huet
Year: 2013
Document Type: Conference Proceeding
STMicroelectronics package design rules Check coverage enhancement with Cadence Ravel
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:G. Bouteloup; J. Jaklic; J. Lopez; B. Lindberg; D. Signoret; O. Franiatte; M. Gracietti; Y. Imbs
Year: 2013
Document Type: Conference Proceeding
Cleaning in electronics: Understanding today's needs
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:P. J. Duchi; Marie Verdier; Anne-Marie Laügt
Year: 2013
Document Type: Conference Proceeding
Novel interconnection technology for flex-on-glass (FOG) applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Haksun Lee; Hyun-Cheol Bae; Kwang-Seong Choi; Yong-Sung Eom
Year: 2013
Document Type: Conference Proceeding
Novel Low-volume solder-on-pad for fine pitch Cu pillar bump
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Yong-Sung Eom; Kwang-Seong Choi; Hyun-Cheol Bae; Haksun Lee
Year: 2013
Document Type: Conference Proceeding
Toward a reliability analysis method of wide band gap power electronic components and modules
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Vincent Rouet; Paul-Etienne Vidal; Catherine Munier; Gregor Massiot; Guillaume Parent; Francisco Carrillo
Year: 2013
Document Type: Conference Proceeding
Effect of protective casting materials on product level reliability under accelerated test conditions
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:T. Marttila; L. Frisk; J. Pippola
Year: 2013
Document Type: Conference Proceeding
Optimizing of PCBA cleaning process through process calibration tools
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:I. Szendiuch; J. Jankovsky; M. Reznicek; M. Saffer; M. Bursik; V. Sitko
Year: 2013
Document Type: Conference Proceeding
Handling of ultra-thin dies with fine pitch micro-bumps for advanced packaging applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Alastair Attard; Karl Malachowski; Zlatko Hajdarevic
Year: 2013
Document Type: Conference Proceeding
UV replication technology for micro optical applications and bonding challenges using active alignment
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Andreas Kraft; Karl Bitzer; Markus Brehm; Rainer Dörfler
Year: 2013
Document Type: Conference Proceeding
Au-Sn Transient Liquid Phase bonding for hermetic sealing and getter activation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:S. Giudice; C. Bosshard
Year: 2013
Document Type: Conference Proceeding
Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Bart Vandevelde; Bart Allaert; Eddy Geerinckx; David Schaubroeck; Dominiek Degryse; Geert Willems; Ralph Lauwaert; Matthias Van Kerckhove; Wim D'Haese
Year: 2013
Document Type: Conference Proceeding
Bridging the infrastructure gap between traditional wire-bond and TSV semiconductor package technology
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Vern Solberg; Wael Zohni; Ilyas Mohammed; Belgacem Haba
Year: 2013
Document Type: Conference Proceeding
3D TSV system in package (SiP) for aerospace applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:C. Bunel; E. Bailly; J. C. Riou; L. Lenoir; M. Pommier
Year: 2013
Document Type: Conference Proceeding
Low temperature dielectric deposition for via-reveal passivation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Steve Burgess; Keith Buchanan; Kath Crook; Mark Carruthers; Daniel Archard
Year: 2013
Document Type: Conference Proceeding
Development of through glass via technology for 3D packaging
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Kentaro Tatsukoshi; Kohei Horiuchi; Nobuhiko Imajo; Motoshi Ono; Masaki Mikayama; Shintaro Takahashi; Shigetoshi Mori; Tim Mobley
Year: 2013
Document Type: Conference Proceeding
Direct integration of Carbon Nanotubes in Si microsystems — Towards truly integrated micro/nano systems
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Einar Halvorsen; Bao Quoc Ta; Nils Hoivik; Knut E. Aasmundtveit; Tormod B. Haugen; Quoc-Huy Nguyen
Year: 2013
Document Type: Conference Proceeding
Graphene applications with printed electronics technology
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Malgorzata Jakubowska; Marcin Sloma; Anna Mlozniak; Daniel Janczak; Grzegorz Wroblewski
Year: 2013
Document Type: Conference Proceeding
A bottom-up approach to developing innovative resistive sensors
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:J. Grisolia; B. Viallet; L. Ressier; N. M. Sangeetha; S. Behar
Year: 2013
Document Type: Conference Proceeding
Investigation on interaction between indium based thermal interface material and copper and silicon substrates
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Przemyslaw Matkowski; Tomasz Falat; Li-Lei Ye; Bartosz Platek; Carl Zanden; Jan Felba; Johan Liu
Year: 2013
Document Type: Conference Proceeding
The discrete vacuum packaging reliability issue in MEMS
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:E. Rizzi; L. Mauri; M. Campaniello; M. Moraja
Year: 2013
Document Type: Conference Proceeding
Copper ribbon bonding for power electronics applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Magdalena Kontek; Max-Hermann Poech; Norman Marenco; Jan Lingner; Wolfgang Reinert
Year: 2013
Document Type: Conference Proceeding
Wireless communicating implant for record of vital diagnosis parameters
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Haentjens Yan; Achkar Charbel; Alquie Georges; Molina Julien; Koskas Fabien; Leborgne Alain; Sou Gerard
Year: 2013
Document Type: Conference Proceeding
Technological investigation of LTCC-based Micro-Electro-Mechanical Systems (MEMS) to improve reliability and accuracy
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Uwe Partsch; Steffen Ziesche; Christian Lenz; Holger Neubert
Year: 2013
Document Type: Conference Proceeding
Holed packaging for mems sensors
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Kevin Formosa; Mark Shaw; Marco Tumiati; Giovanni Graziosi; Fulvio Fontana; Fabrizio Soglio
Year: 2013
Document Type: Conference Proceeding
Demonstration of a 3D embedded wafer-level SIP for smartcard application
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:G. Simon; G. Pares; J. Noiray; J. Mazuir; K. Martinschitz; C. Bouvier; A. Planchais; L. Castagne; L. Mercier; M. Saadaoui
Year: 2013
Document Type: Conference Proceeding
Large-scale manufacturing of embedded subsystems-in-substrates and a 3D-stacking approach for a miniaturised medical system integration
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:R. Aschenbrenner; K.-D Lang; D. Manessis; A. Ostmann; A. Podlasly
Year: 2013
Document Type: Conference Proceeding
Assembly and embedding of ultra-thin chips in polymers
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Christine Harendt; Christiane Schomburg; Elisabeth Penteker; Joachim N. Burghartz; Mahadi-Ul Hassan
Year: 2013
Document Type: Conference Proceeding
High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Maarten Cauwe; Pepijn van der Eijnden; Roel Kusters; Jeroen van den Brand; Frits Verhoeven; Daan van den Ende; Ashok Sridhar
Year: 2013
Document Type: Conference Proceeding
Advanced organic substrate technologies for HiRel and medical applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Dave Alcoe; Frank Egitto; Glen Thomas; Rabindra Das; Steven Rosser; Kim Blackwell; Susan Bagen
Year: 2013
Document Type: Conference Proceeding
Challenges in IC-package-PCB co-design of an advanced flip-chip PoP package for a mobile application
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Laurent Schwarz; Olivier Bayet; Stephane Cosmo; Prem Bacle; Xavier Lecoq; Corinne Devey
Year: 2013
Document Type: Conference Proceeding
Study on high density interconnect with organic build up substrate
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Erina Miyamoto; Masahiro Inoue; Takuya Torii; Toshinori Hida
Year: 2013
Document Type: Conference Proceeding
Systematic characterization of key parameters of hermetic wafer-level Cu-Sn SLID bonding
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:S. Martinsen; M. M. V. Taklo; M. H. M. Kouters; M. Erinc; A.-S B. Vardoy; A. van der Waal; A. Lapadatu; G. Hayes; H. R. Fischer; H. J. van de Wiel
Year: 2013
Document Type: Conference Proceeding
Reliability of wafer-level SLID bonds for MEMS encapsulation
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:V. Vuorinen; T. Suni; S. Vahanen; P. Monnoyer; M. Broas; M. Paulasto-Krockel; H. Xu; H. Dong
Year: 2013
Document Type: Conference Proceeding
MEMS packaging reliability assessment: Last development in the field of residual gas analysis tests
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:B. Savornin; D. Bloch; P.-L Charvet; P. Nicolas
Year: 2013
Document Type: Conference Proceeding
Board level reliability comparison of Bump on Polymer WLCSP structures
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Yu-Chih Chen; Jui-Tu Huang; Hsin-Lun Chang; Hiew-Watt Ng; Chiung-Chen Chen; Chun-Hung Tsai; Martyn Owen; Shih-Ying Wu; Shih-Chieh Lin
Year: 2013
Document Type: Conference Proceeding
Non-destructive fault localization in advanced IC packages using electro optical terahertz pulse reflectometry
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Martin Igarashi; Jesse Alton
Year: 2013
Document Type: Conference Proceeding
Bow management with temperature for thin chips integration
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jean-Philippe Bally; Jean Charbonnier; Helene Issele; Gilles Simon; Christophe Ratin; Christophe Poulain; Edouard Deschaseaux; Nacima Allouti; Myriam Assous; Lionel Vignoud; Rachid Hida; Stephane Moreau
Year: 2013
Document Type: Conference Proceeding
Wafer warpage in FO-WLP — Making friends out of enemies
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Mario Ribeiro; Jose Campos; Eoin O'Toole
Year: 2013
Document Type: Conference Proceeding
60GHz BGA solution packaging reliability and warpage study
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Pierino Calascibetta; Phone-Maw Hla; Norbert Chevrier; Martine Salle; Nadine Martin; Luc Petit; Kim Yong Goh; Romain Pilard; Eric Saugier; Daniel Gloria; Didier Campos; Aymeric Bisognin; Frederic Gianesello; Jerome Lopez; Jean-Michel Riviere; Yvon Imbs
Year: 2013
Document Type: Conference Proceeding
Performance of molding materials and interconnections integrated in interposers dedicated to RF or microwave 3DIC applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Gregory Houzet; B. Flechet; C. Bermond; Philippe Artillan; O. El Bouayadi; T. Lacrevaz; Y. Lamy
Year: 2013
Document Type: Conference Proceeding
Study of 3D process impact on advanced CMOS devices
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:G. Beyer; G. Van der Plas; B. De Wachter; A. La Manna; A. Phommahaxay; Anne Jourdain; E. Sirignano; E. Beyne; S. Van Huylenbroeck; V. Cherman; W. Guo
Year: 2013
Document Type: Conference Proceeding
Flip chip market and technology trends
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Rozalia Beica
Year: 2013
Document Type: Conference Proceeding
Reliable wafer-level-bonding method for MEMS packaging using LTCC interposers
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Beate Capraro; Martin Ihle; Steffen Ziesche; Uwe Partsch; Frank Roscher
Year: 2013
Document Type: Conference Proceeding
Copper pillar shape and related stress simulation studies in flip chip packages
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jean-Marc Yannou; Chang-Chi Lee; Chin-Li Kao; Bradford Factor; Ying-Chih Lee
Year: 2013
Document Type: Conference Proceeding
Integration of capillary self-alignment for face to face micro bump bonding
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Tinne Delande; Silvia Armini; Robert Daily; Marianna Pantouvaki; Philippe Soussan; Nga P. Pham
Year: 2013
Document Type: Conference Proceeding
Joint strength of Cu-to-Cu joint using mixed Ag particle paste
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:K. Niwa; H. Nishikawa
Year: 2013
Document Type: Conference Proceeding
Factors affecting conduction in novel isotropic conductive adhesives filled with silver coated polymer spheres
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:S. Jain; S. Helland; T. Helland; M. Cottrill; C. Liu; Erik Kalland; D. C. Whalley; H. Kristiansen; K. Redford
Year: 2013
Document Type: Conference Proceeding
Evaluation of the hot embossing technology for the fabrication of resonant circuits as instrument visualization method for interventional magnetic resonance imaging
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Stephan Friesecke; Markus Detert; Mandy Kaiser; Bertram Schmidt; Georg Rose
Year: 2013
Document Type: Conference Proceeding
Epoxy molding compounds for high temperature applications
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:J. Martens; A. Mavinkurve; L. Goumans
Year: 2013
Document Type: Conference Proceeding
Copper filled polyurethane based electrically conductive adhesive with improved mechanical strength
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Hiroshi Nishikawa; Li-Ngee Ho
Year: 2013
Document Type: Conference Proceeding
Reliable filling of through vias with silver based conductive adhesives in flexible PEN substrates using low-cost optimized stencil printing methods
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:Jeroen van den Brand; Daan van den Ende; Bart van Remoortere; Anja Henckens; Maria Peter; Steven van Put; Tomas Podprocky
Year: 2013
Document Type: Conference Proceeding
ENEPIG finish: An alternative solution for space printed circuit boards (PCB)
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:N. Venet; P-E Tegehall; A. Chaillot; J. Hokka; J-L Lortal
Year: 2013
Document Type: Conference Proceeding
Vacuum packaging at wafer level for MEMS using gold-tin metallurgy
Publisher: International Microelectronics Assembly and Packaging Society (IMAPS)
Authors:J. Dekker; K. Zoschke; G. Allegato; H. Oppermann; C-A Manier; D. Ruffieux; T. Suni; S. Dalla Piazza
Year: 2013
Document Type: Conference Proceeding
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