Welcome letter
Publisher: American Vacuum Society (AVS)
Authors:Robert L. Rhoades; Paul M. Feeney
Year: 2015
Document Type: Conference Proceeding
The dynamics of the CMP discovery for device applications in IBM
Publisher: American Vacuum Society (AVS)
Authors:Klaus D Beyer
Year: 2015
Document Type: Conference Proceeding
Updates on Ge and SiGe CMP processes for integration as high mobility channel materials
Publisher: American Vacuum Society (AVS)
Authors:Leonardus Leunissen; Lieve Teugels; Patrick Ong; Max Siebert; Martine Delande; Rithu Bhonsle; Sheikh Ansar
Year: 2015
Document Type: Conference Proceeding
Attributes of an advanced node cu-barrier slurry
Publisher: American Vacuum Society (AVS)
Authors:Tim Clore; Mark O'Neill; Maitland Graham; James Schlueter; Brian Cheng Chuan Lee; Chia Chien Lee
Year: 2015
Document Type: Conference Proceeding
Three dimensional pH - potential diagram of cobalt slurry with corrosion rate
Publisher: American Vacuum Society (AVS)
Authors:Mayumi Ouchi; Koji Haga; Koji Mishima; Seiichi Kondo; Yasuhiro Ichige
Year: 2015
Document Type: Conference Proceeding
CMP development of gallium nitride material
Publisher: American Vacuum Society (AVS)
Authors:Baoguo Zhang; Chunrong Jia
Year: 2015
Document Type: Conference Proceeding
Effect of photocatalytic oxidation technology on GaN CMP
Publisher: American Vacuum Society (AVS)
Authors:Xinchun Lu; Tongqing Wang; Hongkai Li; Jie Wang; Jie Cheng; Can Rao
Year: 2015
Document Type: Conference Proceeding
Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet
Publisher: American Vacuum Society (AVS)
Authors:Chikako Takatoh; Hirokuni Hiyama; Syuhei Kurokawa; Terutake Hayashi; Masashi Kitamura; Yutaka Wada; Yuta Tokumoto
Year: 2015
Document Type: Conference Proceeding
Post cleaning and defect reduction for tungsten chemical mechanical planarization
Publisher: American Vacuum Society (AVS)
Authors:James MacDougall; James Hagan; Kaushik Mohan; Leo Tai; Richard Murphy; Ricky Hull; Steven Molis; Wei-Tsu Tseng
Year: 2015
Document Type: Conference Proceeding
FEOL CMP modeling: Progress and challenges
Publisher: American Vacuum Society (AVS)
Authors:Ruben Ghulghazaryan; Jeff Wilson; Ahmed Abouzeid
Year: 2015
Document Type: Conference Proceeding
Reduced defectivity and cost of ownership copper CMP cleans using low pH, BTA free, noble-bond chemistry
Publisher: American Vacuum Society (AVS)
Authors:Christopher Eric Brannon
Year: 2015
Document Type: Conference Proceeding
A new contact model of pad surface asperities utilizing measured geometrical features
Publisher: American Vacuum Society (AVS)
Authors:Eiji Shamoto; Shingo Oshika; Norikazu Suzuki; Yohei Hashimoto
Year: 2015
Document Type: Conference Proceeding
Reactive molecular dynamics simulation of Si chemical mechanical polishing process
Publisher: American Vacuum Society (AVS)
Authors:Xinchun Lu; Jialin Wen
Year: 2015
Document Type: Conference Proceeding
Planarization with suspended polyurethane beads and a stiff counterface: Pad-in-a-bottle experiments and simulation
Publisher: American Vacuum Society (AVS)
Authors:Duane Boning; Ara Philipossian; Wei Fan; Yasa Sampurno; Yun Zhuang
Year: 2015
Document Type: Conference Proceeding
Single-molecule spectroscopic analysis of adsorption phenomena on colloidal silica abrasives used in chemical-mechanical planarization slurries
Publisher: American Vacuum Society (AVS)
Authors:Colin T. Carver; Edward E. Remsen; Donald K. Schorr; Ashwani K. Rawat; Mansour Moinpour; Lauren M. Jacobson
Year: 2015
Document Type: Conference Proceeding
Efficient development of post-CMP cleans for ceria slurries
Publisher: American Vacuum Society (AVS)
Authors:Steve Medd; Robert Green; Peter Wrschka; Paul Feeney
Year: 2015
Document Type: Conference Proceeding
Effect of pad surface temperature and dry/ wet conditions on pad surface properties
Publisher: American Vacuum Society (AVS)
Authors:Hitoshi Morinaga; Ken-ichi Ishikawa; Kazusei Tamai; Kazutoshi Hotta; Michio Uneda; Yuichi Tomiie
Year: 2015
Document Type: Conference Proceeding
Advanced Cu barrier CMP slurries: ACuPLANEGäó 7000 platform
Publisher: American Vacuum Society (AVS)
Authors:Matt VanHanehem; Kevin Jacobs; Todd Buley; Shawn Ware; Jamie Cohen
Year: 2015
Document Type: Conference Proceeding
Mechanism of chemical mechanical polishing of Ti0.4Sb2Te3 film using KMnO4 as oxidizer in an acidic slurry
Publisher: American Vacuum Society (AVS)
Authors:Shasha Li; Zhitang Song; Weili Liu
Year: 2015
Document Type: Conference Proceeding
A novel platform for next generation pad conditioning
Publisher: American Vacuum Society (AVS)
Authors:Elbert Chou; A. Scott Lawing
Year: 2015
Document Type: Conference Proceeding
Brownian diffusion analysis for nano-abrasives in CMP slurry by using fluorescence polarization method
Publisher: American Vacuum Society (AVS)
Authors:Seri Toshiki; Syuhei Kurokawa; Terutake Hayashi
Year: 2015
Document Type: Conference Proceeding
Non-uniformity and removal rate selectivity investigations in through silicon via front side CMP
Publisher: American Vacuum Society (AVS)
Authors:Tongqing Wang; Can Rao; Jie Cheng; Hongkai Li; Haoming Sun; Xinchun Lu
Year: 2015
Document Type: Conference Proceeding
Study on effect of back-surface treatment of silicon wafer in photo lithography process after CMP process
Publisher: American Vacuum Society (AVS)
Authors:Sungmin Kang; Taesung Kim; Ki Min
Year: 2015
Document Type: Conference Proceeding
Planarization improvement using non-porous polishing pad in ILD CMP
Publisher: American Vacuum Society (AVS)
Authors:Wei-Nan Fang; Yung-Chieh Kuo; Yi-Ching Wu; Hung-Bo Lu; Jian-Shiun Chen; Kai En Lin; Che-Chin Yang
Year: 2015
Document Type: Conference Proceeding
The electrochemical behaviour during chemical mechanical polishing of Ti in peroxide based alkaline slurries
Publisher: American Vacuum Society (AVS)
Authors:Chenliang Liang; Zhitang song; Weili Liu
Year: 2015
Document Type: Conference Proceeding
The elastic impact of polishing pad for sapphire polishing
Publisher: American Vacuum Society (AVS)
Authors:Keiichiro Fujimoto; Kazutaka Miyamoto; Katsumasa Kawabata
Year: 2015
Document Type: Conference Proceeding
Particle size distribution shift as a predictor of slurry stability
Publisher: American Vacuum Society (AVS)
Authors:Jimmy Granstrom; Hisashi Takeda; Masaki Tada; Shogo Oonishi
Year: 2015
Document Type: Conference Proceeding
Application of a novel conditioning platform to a tungsten polishing process
Publisher: American Vacuum Society (AVS)
Authors:A. Scott Lawing; William Bellamak
Year: 2015
Document Type: Conference Proceeding
Research on the manufacturing of high purity colloidal silica abrasive with controlled particle size
Publisher: American Vacuum Society (AVS)
Authors:Weili Liu; Fei Qin
Year: 2015
Document Type: Conference Proceeding
Optimization of CO2 bubbling (carbonation) for post CMP cleaning process
Publisher: American Vacuum Society (AVS)
Authors:Minho Hong; Taesung Kim
Year: 2015
Document Type: Conference Proceeding
Evaluation of various composition Cu-resin plates in sapphire DMP (Diamond Mechanical Polishing) process
Publisher: American Vacuum Society (AVS)
Authors:Dong-Ha Kim; Byoung-Jun Cho; Jung-Hwan Lee; Jin-Goo Park
Year: 2015
Document Type: Conference Proceeding
Next generation composite, rigid filter for Chemical Mechanical Planarization
Publisher: American Vacuum Society (AVS)
Authors:Majid Entezarian; Bob Gieger; John Morby
Year: 2015
Document Type: Conference Proceeding
The era of IoT advancing CMP consumables growth
Publisher: American Vacuum Society (AVS)
Authors:Karey Holland; Jerry Yang; Sue Davis; Michael A. Fury; Lita Shon-Roy
Year: 2015
Document Type: Conference Proceeding
Active dummy generation for homogeneity increase in a 130 nm SiGe-BiCMOS process
Publisher: American Vacuum Society (AVS)
Authors:A. Mai; Andreas Kruger; Andreas Trusch; Egbert Matthus; Marco Lisker
Year: 2015
Document Type: Conference Proceeding
Optimized slurry compositions for the polishing of sapphire surfaces
Publisher: American Vacuum Society (AVS)
Authors:Chelsea D. Cates; William R. Gemmill
Year: 2015
Document Type: Conference Proceeding
Chemical mechanical planarization studies on gallium nitride for improved performance
Publisher: American Vacuum Society (AVS)
Authors:Ayse Karagoz; G. Bahar Basim; Max Siebert; Leonardus A. H. Leunissen
Year: 2015
Document Type: Conference Proceeding
Formation of dot patterns with particles using inkjet method to examine and inspect performance of CMP cleaning process
Publisher: American Vacuum Society (AVS)
Authors:Satomi Hamada; Shohei Shima; Akira Fukunaga; Chikako Takatoh; Yutaka Wada
Year: 2015
Document Type: Conference Proceeding
Challenges of TSV backside process integration
Publisher: American Vacuum Society (AVS)
Authors:Catharina Rudolph; Wolfram Steller; Mathias Boettcher; M. Juergen Wolf; Holger Wachsmuth
Year: 2015
Document Type: Conference Proceeding
Simplification of Replacement Metal Gate CMP metrology for FinFET
Publisher: American Vacuum Society (AVS)
Authors:Adrian Santos Lopez; Michael D. Wedlake; Patrick Aniekwu; Steven Trigno
Year: 2015
Document Type: Conference Proceeding
Chemical mechanical polishing implementation on dental implants
Publisher: American Vacuum Society (AVS)
Authors:G. Bahar Basim; Zeynep Ozdemir
Year: 2015
Document Type: Conference Proceeding
Planarization limbo with silicon wafers
Publisher: American Vacuum Society (AVS)
Authors:Paul Feeney; Marie Mitchel; Christopher Shumway; Dan Trojan
Year: 2015
Document Type: Conference Proceeding
Qualification of a ceria slurry reclaim system for shallow trench isolation polish in high volume manufacturing
Publisher: American Vacuum Society (AVS)
Authors:Franz Brummer; Greg Westhauser; Greg Goodwin; Allen Evans; Alejandro Guerra; Andreas Wunderlich; Brad Yellitz; Bret Rhea; Scott Ray; Larry Kuehn; Tito Tang; Clayton Judd; Pete Beckage
Year: 2015
Document Type: Conference Proceeding
Study on evaluation method for surface topography of polishing pad based on optical Fourier transform
Publisher: American Vacuum Society (AVS)
Authors:Yoshihiro Mochizuki; Keisuke Suzuki; Panart Khajornrungruang; Takahiro Tajiri; Hisanori Matsuo; Hirokuni Hiyama
Year: 2015
Document Type: Conference Proceeding
Ellipsometric measurement of particle-spiked wafer surfaces
Publisher: American Vacuum Society (AVS)
Authors:Hirokuni Hiyama; Hayato Kotagiri; Shohei Shima; Satomi Hamada; Mitsuhiro Watanabe; Eiichi Kondoh
Year: 2015
Document Type: Conference Proceeding
In-line refractive index monitoring for CMP slurry fault detection
Publisher: American Vacuum Society (AVS)
Authors:Marcus Kavaljer; Robert Johnston; Carlo Dominic Aparece
Year: 2015
Document Type: Conference Proceeding
Investigation of CMP on GaN substrate for led manufacturing
Publisher: American Vacuum Society (AVS)
Authors:Dan Guo; Chunli Zou; Hua Gong; Guoshun Pan; Yuhong Liu
Year: 2015
Document Type: Conference Proceeding
A study of surface defects of GaN during CMP process
Publisher: American Vacuum Society (AVS)
Authors:Zhou Yan; Xu Li; Zou Chunli; Gong Hua; Liu Yuhong; Pan Guoshun
Year: 2015
Document Type: Conference Proceeding
Light scattering analysis for undiluted slurry management
Publisher: American Vacuum Society (AVS)
Authors:Michael A. Fury; Kelly A. Barry
Year: 2015
Document Type: Conference Proceeding
Normal force and behavior of containing water during the compression of PVA brush
Publisher: American Vacuum Society (AVS)
Authors:Kenya Nishio; Toshiyuki Sanada; Hirokuni Hiyama; Akira Fukunaga
Year: 2015
Document Type: Conference Proceeding
Friction monitoring of conventional diamond conditioner and its application
Publisher: American Vacuum Society (AVS)
Authors:Sunjae Jang; Taesung Kim; Hojoong Kim; Hasub Hwang; Donghyun Lim; Byungil Lee
Year: 2015
Document Type: Conference Proceeding
Effects of silica abrasive size on sapphire CMP performances and their removal mechanisms
Publisher: American Vacuum Society (AVS)
Authors:Xiaolei Shi; Yan Zhou; Chunli Zou; Hua Gong; Guoshim Pan; Li Xu
Year: 2015
Document Type: Conference Proceeding
Investigation on cu height process control method in BEOL Cu CMP
Publisher: American Vacuum Society (AVS)
Authors:Mark Dougherty; Gerett Yocum; Jason Mazzotti; Ji Chul Yang; Daniel Scheffler
Year: 2015
Document Type: Conference Proceeding
Challenges in Post CMP in-situ cleaning for sub-14nm device yield enhancement
Publisher: American Vacuum Society (AVS)
Authors:Hong Jin Kim; Liqiao Qin; Sumeet Kashyap; Tae Hoon Lee
Year: 2015
Document Type: Conference Proceeding
High-rate CMP process for large PCB by controlling platen coolant temperature
Publisher: American Vacuum Society (AVS)
Authors:Minjong Yuh; Hyoungjae Kim; Haedo Jeong
Year: 2015
Document Type: Conference Proceeding
Study of inhibition mechanism of glycine on the electrochemical behavior of Mo in the alkaline slurry
Publisher: American Vacuum Society (AVS)
Authors:Hui Feng; Guang Yang; Xin-Ping Qu; Xu Wang
Year: 2015
Document Type: Conference Proceeding
Advanced CMP conditioning for front end applications
Publisher: American Vacuum Society (AVS)
Authors:Jennifer Sokol; John Zabasajja; Terry Pfau; Vince Laraia; Rob Rhoades; Noah Shanti; Matt Fritz
Year: 2015
Document Type: Conference Proceeding
Accelerated corrosion and oxidation of tungsten plug during tungsten CMP
Publisher: American Vacuum Society (AVS)
Authors:Hyunghwan Kim; Keejoon Oh; Kyungho Hwang; Nohjung Kwak
Year: 2015
Document Type: Conference Proceeding
Yield improvement through improved uniformity via application of multi-zone polish head for STI-CMP
Publisher: American Vacuum Society (AVS)
Authors:Mike Liu; Benno Milmore; Scott Wills; Yanmei Xing
Year: 2015
Document Type: Conference Proceeding
Repulsive effect between abrasives during CMP process
Publisher: American Vacuum Society (AVS)
Authors:Song Yuan Chang; Ming Hui Lu; Ming Che Ho; Peng Hsin Wang; Yen Tao Tseng
Year: 2015
Document Type: Conference Proceeding
Influence into platen and polishing pad surface temperature on removal rate in sapphire-chemical mechanical polishing
Publisher: American Vacuum Society (AVS)
Authors:Yoshihiro Takahashi; Yoshio Nakamura; Michio Uneda; Kazutaka Shibuya; Ken-ichi Ishikawa; Takahiro Matsunaga; Daizo Ichikawa
Year: 2015
Document Type: Conference Proceeding
CMP solutions for 3D-NAND staircase CMP
Publisher: American Vacuum Society (AVS)
Authors:Brian Reiss; Jae-Dong Lee; Sudeep Pallikkara Kuttiatoor; Viet Lam; Tina C. Li; Renhe Jia
Year: 2015
Document Type: Conference Proceeding
Effects of surface zeta potential on the filtration behavior of colloidal abrasives
Publisher: American Vacuum Society (AVS)
Authors:Isamu Funahashi; Henry Wang; Hj Yang; Bob Shie; Dean Tsou; YiWei Lu
Year: 2015
Document Type: Conference Proceeding
Novel CMP slurry for polishing silicon containing materials
Publisher: American Vacuum Society (AVS)
Authors:Yun-Lung Ho; Chun-Chieh Lee; Ming-Hui Lu; Ming-Che Ho; Song-Yuan Chang
Year: 2015
Document Type: Conference Proceeding
Conditioner characterization and implementation for impacts of diamonds on CMP pad texture and performance
Publisher: American Vacuum Society (AVS)
Authors:Todd Buley; John McCormick; Zhan Liu
Year: 2015
Document Type: Conference Proceeding
Optimal shape of retainer ring considering edge exclusion and slurry film thickness
Publisher: American Vacuum Society (AVS)
Authors:Taesung Kim; Cheolmin Shin; Jinwoo Park; Hongyi Qin
Year: 2015
Document Type: Conference Proceeding
Removal mechanisms of glass and sapphire materials by slurry free lapping
Publisher: American Vacuum Society (AVS)
Authors:Young-Gil Seo; Deog-Ju Moon; Jin-Goo Park; Sung-Ho Park; Si-Hyeong Cho; Nagendra Prasad Yerriboina
Year: 2015
Document Type: Conference Proceeding
Study on innovative plasma fusion CMP and its application to processing of diamond substrate
Publisher: American Vacuum Society (AVS)
Authors:Hideaki Nishizawa; Hideo Aida; Chengwu Wan; Koki Oyama; Syuhei Kurokawa; Toshiro K. Doi; Seongwoo Kim; Yasuhisa Sano
Year: 2015
Document Type: Conference Proceeding
Optimization of machining conditions of basic-type CMP/P-CVM fusion processing using SiC substrate
Publisher: American Vacuum Society (AVS)
Authors:Yasuhisa Sano; Toshiro Doi; Syuhei Kurokawa; Tadakazu Miyashita; Koki Oyama; Kousuke Shiozawa; Kazuto Yamauchi; Hideo Aida; Haruo Sumizawa
Year: 2015
Document Type: Conference Proceeding
Slurry free lapping of silicon wafer for the application of thinning of wafer backside during TSV and packaging
Publisher: American Vacuum Society (AVS)
Authors:Jin-Goo Park; Nagendra Prasad Yerriboina; Sung-Ho Park; Si-Hyeong Cho; Young-Gil Seo; Deog-Ju Moon
Year: 2015
Document Type: Conference Proceeding
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